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race cars to victory in the 2008 FIA
World Touring Car Champion (WTCC)
series.
The final round of the gruelling WTCC
series, which took place in Macau (13 -
16 November 2008), culminated with
SEAT taking both the Drivers' and
Manufacturers' world champion titles.
Although already in the bag at the end
of the penultimate race in Japan, the
titles were confirmed by Yvan Muller
clinching 1st place and his first world
title at the wheel of the SEAT León TDI
WTCC race car, closely followed by
Gabriele Tarquini, who took 2nd place.
Thus, the season closed with SEAT
clinching two well-earned world titles,
all from an impressive round of 12
victories and 19 podium finishes during
the season. Also of great significance is
that the win makes the SEAT León TDI
the first diesel-engined car to win a
WTCC, and putting to an end BMW's
three year domination of the series.
All in all, SEAT ended up clinching a total
of 326 points to become Manufacturers'
world champion, with Muller collecting
114 points to take the Drivers’
Championship, and Tarquini collecting
88 points to become runner up.
The victories were accomplished in
SEAT’s petrol and TDI WTCC Leóns, the
latter being hailed as the best car of the
championship, having clinched all
victories during the series.
ACG’s advanced composite versatile
processing, medium temperature
moulding MTM57 component prepregs,
which are extensively used across these
championship cars, have played a vital
role in the victories. Magma
Composites, based in Olesa De
Montserrat, Spain, and SEAT’s own
Sport facilities used ACG’s MTM57
prepregs to manufacture a range of
composite carbon fibre components to
minimise vehicle weight, which led to
subsequent improvements to both
performance and handling
characteristics.
The front and rear bumper, front and
rear lateral wings, front beam, fuel tank
cover, rear floor, rear structure for
bumper, outside and inside panels of
front and rear doors, rear spoiler,
structure for spoiler, console, rear view
mirrors, and some protective parts in
the engine bay, are just some of the
parts made using ACG’s MTM57
prepregs. Parts were manufactured in
both cosmetic and painted finishes and
cured via oven/autoclave processing.
Good impact resistance, a minimum
cure time of 30 minutes at 120°C
(248°F), plus optional lower temperature
cures, versatile processing (autoclave,
vacuum bag or press moulding), and
good tack and drape, make ACG’s
MTM57 prepreg the material of choice
for applications of this nature.
Copyright SEAT
1 12964 Panama Street • Los Angeles, CA 90066 • Phone: 310.822.8229 FAX: 310.574.2045 • microelectronics@teledyne.com • www.teledynemicro.com
SC100712 TMT Overview
Microelectronic
Technologies
Approved for
Export DAR
07/14/10
DAR090709
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SC100712 TMT Overview
Teledyne Microelectronic Technologies
 Microelectronic Packaging & Products
– COTS to Class K
– More than 250,000 single die to
multichip packages per year
 Technologies
– RF & Microwave
– Optoelectronics
– Secure Communications
– Power and Mixed Signal
– LED Backlights & Light Engines
– Ultra-high Speed Communications
 Markets
– Defense (Class H certified)
– Avionics (COTS)
– Space (Class K certified)
– Secure Communications
– Ruggedized Industrial
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
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SC100712 TMT Overview
 World Class Facility, established in 1964
– Los Angeles, California
– 140,000 ft.2 total
– 90,000 ft.2 manufacturing floor (65,000 ft2. clean room)
 From prototype to production
– Enhance design for manufacturability
– Miniaturize size and reduce weight
– Improve performance and reliability
– Comprehensive testing and screening
– Obsolescence management
 Microelectronics Trusted Source
– Packaging, Assembly and Test Services
– DoD Accredited to
• Mission Assurance Category 1
• Trusted Category 1A
Teledyne Microelectronic Technologies
Prototype to full scale production of complex, mixed technology and miniaturized assemblies
　
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