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Aerospace
Supplemental Purchase Order Conditions (SPOC) Manual
UNCONTROLLED IN HARDCOPY
Revision H Effective Date: 15 January 2009 69
308.4 Clearwater Orders Only
100% electrical net list testing shall be conducted after solder mask. If the board has a bonded heat sink, 100% verification
that the heat sink is not shorted to board is required.
The number and location of test coupons shall be in accordance with the Honeywell specification. Each coupon or test strip
shall be suitably marked to retain traceability.
Thermally stressed x and y coupons shall be analyzed by the supplier to determine acceptability of the product prior to
shipment to Honeywell. Test coupons shall be delivered to Honeywell. Any discrepancy shall have prior written approval by
Honeywell.
When the Honeywell heat sink bonding spec (FPC 29350-01) is called out, the following minimum requirements are applicable
to the bonding of PWBs to heat sinks:
1. Nickel plate
2. Grit blast surfaces of heat sink
3. Clean surfaces of heat sink with pumice scrub or equivalent followed by an isopropyl alcohol rinse
4. Store pre-preg/film bonding materials in a vacuum storage cabinet or equivalent for 1 hour prior to bonding
5. Bond assembly
The manufacturer shall build, screen, and inspect printed wiring products in accordance with Mil-P-50884.
308.5 Olathe Orders Only
Quality Conformance Inspection data in accordance with IPC-6012 (latest revision) including the solderability test data shall
be supplied with each lot of printed wiring boards. Coupons or sample parts used for this inspection shall be retained by the
supplier and shall be supplied only when requested by Honeywell.
For Purchased Circuit Card Assemblies, supplier shall comply with 001-06010-0000, Honeywell Standards and Processes
for Circuit Card Assemblies and Bare Boards and 001-00072-0000, Honeywell Procurement Specification for Printed Circuits
Boards.
308.6 Urbana Orders Only
Use Printed Wiring Board specification 06-03-005.
Revisions: Minor edits for clarity. Teterboro box deleted, remaining paragraphs renumbered.
SPOC 309 – Flexible & Rigid Flex Printed Wiring Boards
309.1 Toronto Orders Only
Flexible and Rigid Flex Printed Wiring Boards shall meet all the requirements of Toronto's QAS 80/3 - Quality Assurance
Specification.
309.2 Glendale Orders Only
In addition to the coupons required for QCI testing, each panel shall have at least one corresponding serialized coupon that
shall be submitted to Honeywell with the order. The coupon shall be serialized in such a manner as to be identifiable with the
boards from the same panel. If shown on the master drawing, one coupon of the Flex Only portion from each rigid flex panel
shall also be sent. Coupons shall not be packaged in the same bag as the board but may be grouped in a single bag. When
supplied, coupons that were used for QCI testing shall be appropriately identified.
Revisions: No changes.
Aerospace
Supplemental Purchase Order Conditions (SPOC) Manual
UNCONTROLLED IN HARDCOPY
Revision H Effective Date: 15 January 2009 70
SPOC 316 – Component Lead Requirement – CANCELLED
Revisions: SPOC cancelled.
SPOC 322 – Test Report Requirement – CANCELLED
Revisions: SPOC cancelled.
SPOC 323 – Solder Dip Requirement – CANCELLED
Revisions: SPOC cancelled.
*Revised / **Added
SPOC 325 – Electronics Solder Requirements *
Product covered under this Purchase Order is to be assembled and soldered per ANSI/J-STD-001 Revision (latest), Class 3,
(Standard Requirements for Soldered Electrical & Electronic Assemblies), and acceptance criteria based on IPC-A-610 Revision
(latest) and applicable Honeywell “M” specification, to the class as specified on the PO. Workmanship and testing also shall
conform to the class of IPC160 specified on the purchase order. Any exceptions or deviations must be delineated on the
Honeywell drawing and / or Honeywell specification.**
If solder testing is required per the drawing/specification then the parts must meet the applicable soldering requirements of the
specification listed below:
RODUCT TYPE SPECIFICATION METHOD
SEMICONDUCTORS MIL-STD-750 2026
MICROELECTRONICS MIL-STD-883 2003
RIGID PRINTED WIRING BOARDS MIL-P-55110 PARA 3.7.4.5*
RIGID FLEX PRINTED WIRING BOARDS MIL-P-50884 PARA 3.4.6
PARA 3.7.14
FLEXIBLE PRINTED MIL-P-50884 PARA 3.4.6
PARA 3.7.14
ALL OTHER PARTS MIL-STD-202 208
WHEN REQUIRED BY PURCHASE ORDER MIL-STD-2000 PARA 5.4.4
Aerospace
Supplemental Purchase Order Conditions (SPOC) Manual
UNCONTROLLED IN HARDCOPY
Revision H Effective Date: 15 January 2009 71
　
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