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Supplier’s processes and/or product using the IPCA Industrial Process Control Assessment (or other) to validate compliance.
Revisions: No changes.
SPOC 538 – Boeing Approved Source
Supplier must comply with the latest revision of the D1-4426 Boeing Approved Process Sources requirement specification and
be a Boeing approved source.
Revisions: No changes.
*Revised / **Added
SPOC 539 – Required Sources for Jewel, Miniature and Instrument Bearings *
539.1 Requirements for Jewel Bearings
The supplier shall supply jewel bearings in accordance with FAR 52.208-1, “Required Source for Jewel Bearings”
539.2 Requirements for Miniature and Instrument Ball Bearings
The supplier shall supply ball bearings in accordance with FAR 52.208-7000 “Required Sources for Miniature and
Instrument Ball Bearings”.
Revisions: Title changed. Rewritten for clarity.
Aerospace
Supplemental Purchase Order Conditions (SPOC) Manual
UNCONTROLLED IN HARDCOPY
Revision H Effective Date: 15 January 2009 93
*Revised / **Added
SPOC 540 – Teardown Analysis Inspection *
All lots supplied on this order are subject to part teardown analysis to an LTPD of ten (10), with a maximum accept number of
one. Internal workmanship and bond strength will be examined to the criteria of MIL-STD-883, Method 2010, where the detail
specification requires MIL-STD-883 processing or to the criteria of MIL-STD-750 for discrete transistors or diodes.
Revisions: SPOC rewritten for clarity.
*Revised / **Added
SPOC 541 – Insulation, Isolation, Dielectric Testing *
Insulation, Isolation, Dielectric isolation (DITMCO) testing is required. Records of DITMCO testing shall be sent with the parts.
Revisions: Title of SPOC revised.
*Revised / **Added
SPOC 542 – Diodes – Metallurgical Bond *
MIL-S-19500 diodes with dash 1 part numbers shall be constructed using only a metallurgical bond between the die and the
header.
Revisions: SPOC rewritten for clarity.
SPOC 543 – Ceramic Capacitor Lead Wire Requirement – CANCELLED
Revisions: SPOC cancelled.
SPOC 544 – CCA Requirements
For Purchased Circuit Card Assemblies, supplier shall comply with 001-06010-0000, Honeywell Standards and Processes for
Circuit Card Assemblies and Bare Boards and 001-00072-0000, Honeywell Procurement Specification for Printed Circuits
Boards.
Revisions: No changes.
Aerospace
Supplemental Purchase Order Conditions (SPOC) Manual
UNCONTROLLED IN HARDCOPY
Revision H Effective Date: 15 January 2009 94
SPOC 545 – Inspection Requirement
545.1 Glendale Orders Only
All articles shall be burr and sliver free at 6-10X magnification - illuminated. A burr is defined as any sharp projection of metal
protruding from the geometric surface defined by the drawing. A burr is typically caused by a manufacturing process such as
machining, drilling or casting, which may be short or long in relation to its thickness and occurs on edges or corners. Slivers
are loose or torn pieces of metal rolled into the surface or extending from the surface.
545.2 Clearwater Orders Only
100% visual inspection shall be performed at 10x magnification for permanent and legible marking, body finish, lead finish,
insulation, lead straightness, pin holes, excessive material, material, misalignment, and any other visual or mechanical
defects.
Revisions: No changes.
SPOC 546 – Inspection Report Requirement – CANCELLED
Revisions: SPOC cancelled. Contents covered in SPOC 124, 128.
SPOC 547 – Summary Report Requirement
Manufacturer shall supply summary reports listing all screening and Quality Conformance Inspection (QCI) tests performed on or
covering the components supplied to this order, as specified in the applicable military specification and/or Source Control
Drawing (SCD). For periodic tests covering but not performed on the lot shipped, the date of test and lot date code tested shall
be shown. Tests involving Percent Defective Allowable (PDA) must show the number of components tested and the number
passing, or the calculated PDA for that test. This data may be incorporated into the manufacturer's certificate of conformance.
Revisions: No changes.
SPOC 548 – AOI (Automatic Optical Inspection) of Circuit Card Assemblies
548.1 AOI Requirements
All CCA’s will be programmed on an AOI machine to inspect for: wrong, missing or extra parts; polarity and solder joint
criteria. Solder joint criteria may be inspected using X-Ray instead of AOI. Records of AOI operation by UCN and Part
number shall be retained by the Seller and made available upon request by the Buyer.
548.2 Clearwater Orders Only
　
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